Department of Materials Science and Engineering
National Cheng Kung University
World Scientific Publishing Co. Pte. Ltd., 2018
Solder has been so unique in the manufacturing of all electronic products which provides the mechanical joining and electrical transport for facilitating the functioning of embedding products. The successful implementation of solder in electronic industry for more than one century has shown solder the unreplaceable role up to far as interconnect materials. It will be still so in the foreseeable future although the efforts have been initiated to try to reduce the solder use so as to simplify the manufacturing process and environment for electronic goods. The properties of solder are so adaptable for manufacturing of the variety of products in need such like cast, bar, wire, preform, ball, and powder, etc. The compatibility between solder and chemicals has given rise to various solder/solder elements containing products including plating solutions, paste, etc. The availability of all these solder products has been allowing the successful development of thousands of industrial, automotive, aerospace, marine, avionics, communication and consumer electronics, and more to come. The materials properties of solder determine the manufacturing method and condition for the solder products and the solder joints. The application needs of solder joints in all areas has acquired the understanding to the materials science of solder and thus the large efforts of research from all aspects. The understanding through research to the solder material science has been rather fascinating in the past decades. The research has accumulated decks of literatures devoted to the solder material science. Now may be the time to have a chance to look at some of the wisdoms together, although seems not possible to cover all. This book appreciates the various subjects having been disclosed including industrial products, solder joint technology, solderability and soldering reaction, physical metallurgy of solder, mechanical properties of solder, the impact of electrical current on solder, i.e., electromigration, reliability of solder joint. It is realized that the volume limit will not allow inclusion of many other interesting aspects, for example, the computational materials science of solder. It also needs to mention that all the subjects being in touch in this book are mainly to provide summary information due to the concern of page limit. Readers are suggested to refer to the source literatures to have further in depth understanding of the topic of interest. Nevertheless, it is believed that the information sources cited in every chapter are to the extent of providing good understanding of the subject.