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Solder Materials

Solder Materials

Kwang-Lung Lin

Department of Materials Science and Engineering

National Cheng Kung University

World Scientific Publishing Co. Pte. Ltd., 2018

ISBN 978-981-3237-60-5

Abstract

     Solder has been so unique in the manufacturing of all electronic products which provides the mechanical joining and electrical transport for facilitating the functioning of embedding products. The successful implementation of solder in electronic industry for more than one century has shown solder the unreplaceable role up to far as interconnect materials. It will be still so in the foreseeable future although the efforts have been initiated to try to reduce the solder use so as to simplify the manufacturing process and environment for electronic goods. The properties of solder are so adaptable for manufacturing of the variety of products in need such like cast, bar, wire, preform, ball, and powder, etc. The compatibility between solder and chemicals has given rise to various solder/solder elements containing products including plating solutions, paste, etc. The availability of all these solder products has been allowing the successful development of thousands of industrial, automotive, aerospace, marine, avionics, communication and consumer electronics, and more to come. The materials properties of solder determine the manufacturing method and condition for the solder products and the solder joints. The application needs of solder joints in all areas has acquired the understanding to the materials science of solder and thus the large efforts of research from all aspects. The understanding through research to the solder material science has been rather fascinating in the past decades. The research has accumulated decks of literatures devoted to the solder material science. Now may be the time to have a chance to look at some of the wisdoms together, although seems not possible to cover all. This book appreciates the various subjects having been disclosed including industrial products, solder joint technology, solderability and soldering reaction, physical metallurgy of solder, mechanical properties of solder, the impact of electrical current on solder, i.e., electromigration, reliability of solder joint. It is realized that the volume limit will not allow inclusion of many other interesting aspects, for example, the computational materials science of solder. It also needs to mention that all the subjects being in touch in this book are mainly to provide summary information due to the concern of page limit. Readers are suggested to refer to the source literatures to have further in depth understanding of the topic of interest. Nevertheless, it is believed that the information sources cited in every chapter are to the extent of providing good understanding of the subject.

 

摘要

銲錫在電子產品製造過程的獨特角色,在於提供所有功能元件的接合與電性導通,電子產業已應用銲錫超過一世紀,即使有相當多的研究試圖研發替代性材料與技術,但是長久所累積的製程技術、材料科學以及規範知識等,使銲錫在可預見的未來仍是無可取代的電子接合材料,此歸因於銲錫材料的特性,使其易於加工製造成各種形式的材料,例如錫條、錫線、錫球、錫粉等,銲錫也可以和多種化學品相容,因此其產品更可推廣到電鍍液、錫膏等。由於銲錫材料可製作之產品的多樣性,使其成功廣泛地應用在各種產業包括汽車、航太、船艦、通訊、消費性電子等,其應用是無遠弗屆。銲錫的材料性質,決定了銲錫產品與銲錫接點的製造方法與製造條件,因此數十年來為數眾多的研究探討銲錫在各種製造與應用環境之下的材料科學,這些研究累積了無數的文獻資料與相關知識,本書即是試著綜整銲錫的材料科學與技術知識,包括工業產品、銲錫接合技術、銲錫性、銲錫反應、銲錫的物理冶金、銲錫機械性質、銲錫電遷移行為、銲錫可靠性等,但限於篇幅,仍無法涵蓋所有銲錫有趣的相關研究例如銲錫計算科學等。本書嘗試總整銲錫材料科學相關知識,涵蓋了詳盡的文獻資料,也提供研究或產業工作者相關主題資料查詢的參考。

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